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Emanuele Scrofani
Emanuele Scrofani
STMicroelectronics
Electrical resistance and conductance
Power density
Materials science
Composite material
Soldering
3
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3
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Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices
2013
IEEE Transactions on Components, Packaging and Manufacturing Technology
Antonino Scandurra
Giuseppe Francesco Indelli
Roberto Zafarana
A. Cavallaro
Emanuele Scrofani
Jean Paul Giry
Sebastiano Russo
Mietek Bakowski
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Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding
2009
EMPC | European Microelectronics and Packaging Conference
Antonino Scandurra
Giuseppe Francesco Indelli
Roberto Zafarana
A. Cavallaro
Emanuele Scrofani
Sebastiano Russo
Jean Paul Giry
Salvatore Pignataro
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Aluminum ribbon on a power device
2009
EMPC | European Microelectronics and Packaging Conference
Giuseppe Cristaldi
Giuseppe Luigi Malgioglio
Emanuele Scrofani
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