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Roberto Zafarana
Roberto Zafarana
STMicroelectronics
Composite material
Materials science
Epoxy
Molding (process)
Delamination
4
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19
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Study of adhesion failure due to molding compound additives at chip surface in electronic devices
2001
Journal of Adhesion Science and Technology
Antonino Scandurra
Roberto Zafarana
Yuichi Tenya
Salvatore Pignataro
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Citations (3)
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