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Ang-Ying Lin
Ang-Ying Lin
Electronic engineering
Composite material
Materials science
Wafer
Wafer dicing
3
Papers
27
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Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging
2018
ECTC | Electronic Components and Technology Conference
Chia-Hsin Lee
Jay Su
Xiao Liu
Qi Wu
Jim-Wein Lin
Puru Lin
Cheng-Ta Ko
Yu-Hua Chen
Wen-Wei Shen
Tzu-Ying Kou
Shin-Yi Huang
Yu-Min Lin
Kuan-Neng Chen
Ang-Ying Lin
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Citations (9)
An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications
2018
ECTC | Electronic Components and Technology Conference
Yu-Min Lin
Sheng-Tsai Wu
Wen-Wei Shen
Shin-Yi Huang
Tzu-Ying Kuo
Ang-Ying Lin
Tao-Chih Chang
Hsiang-Hung Chang
Shu-Man Lee
Chia-Hsin Lee
Jay Su
Xiao Liu
Qi Wu
Kuan-Neng Chen
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Citations (10)
Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP
2017
ECTC | Electronic Components and Technology Conference
Wen-Wei Shen
Yu-Min Lin
Hsiang-Hung Chang
Tzu-Ying Kuo
Huan-Chun Fu
Yuan-Chang Lee
Shu-Man Lee
Ang-Ying Lin
Shin-Yi Huang
Tao-Chih Chang
Alvin Lee
Jay Su
Baron Huang
Dongshun Bai
Xiao Liu
Kuan-Neng Chen
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Citations (8)
1