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Shu-Man Lee
Shu-Man Lee
Electronic engineering
Composite material
Wafer dicing
Materials science
Integrated circuit packaging
2
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18
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0
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An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications
2018
ECTC | Electronic Components and Technology Conference
Yu-Min Lin
Sheng-Tsai Wu
Wen-Wei Shen
Shin-Yi Huang
Tzu-Ying Kuo
Ang-Ying Lin
Tao-Chih Chang
Hsiang-Hung Chang
Shu-Man Lee
Chia-Hsin Lee
Jay Su
Xiao Liu
Qi Wu
Kuan-Neng Chen
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Citations (10)
Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP
2017
ECTC | Electronic Components and Technology Conference
Wen-Wei Shen
Yu-Min Lin
Hsiang-Hung Chang
Tzu-Ying Kuo
Huan-Chun Fu
Yuan-Chang Lee
Shu-Man Lee
Ang-Ying Lin
Shin-Yi Huang
Tao-Chih Chang
Alvin Lee
Jay Su
Baron Huang
Dongshun Bai
Xiao Liu
Kuan-Neng Chen
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Citations (8)
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