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Puru Lin
Puru Lin
Materials science
Optoelectronics
Electronic engineering
Wafer
Composite material
5
Papers
21
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Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging
2018
ECTC | Electronic Components and Technology Conference
Chia-Hsin Lee
Jay Su
Xiao Liu
Qi Wu
Jim-Wein Lin
Puru Lin
Cheng-Ta Ko
Yu-Hua Chen
Wen-Wei Shen
Tzu-Ying Kou
Shin-Yi Huang
Yu-Min Lin
Kuan-Neng Chen
Ang-Ying Lin
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Citations (9)
Fine trace substrate with 2µm fine line for advanced package
2015
ICEP-IAAC | International Conference on Electronic Packaging and iMAPS All Asia Conference
Dyi-Chung Hu
Puru Lin
Yu-Hua Chen
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A PoP structure to support I/O over 2000
2014
ECTC | Electronic Components and Technology Conference
Dyi-Chung Hu
Puru Lin
Yu-Hua Chen
Chun-Ting Lin
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Fabrication and Characterization of a Three-Dimensional Flexible Thermopile
2008
Japanese Journal of Applied Physics
Puru Lin
Ching-Yi Wu
Yung-Ming Cheng
Yuh-Jiuan Lin
Fon-Shan Huang
Star Ruey-Shing Huang
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Citations (11)
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