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Jong-Woo Choi
Jong-Woo Choi
Samsung Electro-Mechanics
Computer science
Quad Flat No-leads package
Soldering
Package on package
Wearable Electronic Device
3
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PMV (Plating Mold Via) interconnection development in molded SiP modules
2014
Do-Jae Yoo
Jong-In Ryu
Gyu-Hwan Oh
Yong-Choon Park
Ki-Ju Lee
Jinsu Kim
Jong-Woo Choi
Ki-Chan Kim
Il-Hyeong Lee
Tae-Sung Kang
Peter Lim
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Advanced Bump Structure for Improving the Board Level Characteristics of WLCSP
2011
CSTIC | China Semiconductor Technology International Conference
Chang-Bae Lee
Jong-Woo Choi
Jin-Su Kim
Sangsoon Choi
Do-Jae Yoo
Seung-Wook Park
Young Do Kweon
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SMT Technology and Reliability for 01005
2007
Jong-Woo Choi
Chang-Bae Lee
Jin-Su Kim
Jae-Chun Do
Sung Yi
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