PMV (Plating Mold Via) interconnection development in molded SiP modules

Recently, there are increasing demands of a size reduction and a fine interconnection technology, especially for System-in-Package (SiP) module and Package on Package (POP) module in a smart phone and a wearable electronic device. In this study, we presented the Plating Mold Via (PMV) interconnection technology as an innovative fine pitch interconnection solution between substrate I/O pads and package I/O pads in molded System-in-Package (SiP) modules. Similar to the Through Mold Via (TMV), the laser mold via process is first performed to produce a through-via in the Epoxy Mold Compound (EMC) mold, but plating and Soldering process are used simultaneously to produce the metallurgical interconnection to embody the I/O pins of the over-molded surface. After the PMV technology is described, a study of PMV in the molded packaging module is followed. The study is conducted using a test vehicle of SiP module that contains flip chips, Quad Flat Non-leaded (QFN) packages and passives. It is focused on several int...