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Advanced Bump Structure for Improving the Board Level Characteristics of WLCSP
Advanced Bump Structure for Improving the Board Level Characteristics of WLCSP
2011
Chang-Bae Lee
Jong-Woo Choi
Jin-Su Kim
Sangsoon Choi
Do-Jae Yoo
Seung-Wook Park
Young Do Kweon
Keywords:
Chip-scale package
Electronic engineering
Materials science
Automotive engineering
Computer science
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