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Paul M. Feeney
Paul M. Feeney
Chemistry
Engineering
Manufacturing engineering
Chemical-mechanical planarization
Polymer chemistry
7
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92
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2015
IEEE International Conference on Industry Applications
Paul M. Feeney
Robert L. Rhoades
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Modeling for pad wear control during conditioning in CMP
2011
Toshi Kasai
Sriram Anjur
Haresh Siriwardane
Paul M. Feeney
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Composition polissante contenant une polyether amine
2007
Jeffrey Dysard
Paul M. Feeney
Sriram Anjur
Timothy Johns
Yun-Biao Xin
Li Wang
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9:20-9:40 "A Case Study for Fixed Abrasives in CMP: Production Acceptance of a New Technology through Performance, Persistence and Partnerships,"
2006
C. Ryu
J. Choi
W. Lee
S. Kim
G Choi
N. Kwak
J. Kim
J. Sorooshian
D. Hooper
Yongsik Moon
R. Venigalla
L. Economikos
Sriram Anjur
Jeffrey Dysard
Paul M. Feeney
Timothy Johns
M. Kason
M. Perez
R. Romine
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Analysis of Large Particle Count in Fumed Silica Slurries and Its Correlation with Scratch Defects Generated by CMP
2006
Journal of The Electrochemical Society
Edward E. Remsen
Sriram Anjur
David Boldridge
Mungai Kamiti
Shoutian Li
Timothy Johns
Charles Dowell
Jaishankar Kasthurirangan
Paul M. Feeney
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