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H. Ullmann
H. Ullmann
STMicroelectronics
Materials science
Electronic engineering
CMOS
Etching
Photolithography
4
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Deep UV Lithography for 0.35μm Design Rules Application to CMOS Technology with Three Metallization Levels
1994
ESSDERC | European Solid-State Device Research Conference
Françoise Vinet
N. Buffet
Michel Heitzmann
M. Laurens
C. le Cornec
M. Lerme
P. Molle
Yves Morand
Thierry Mourier
H. Ullmann
C. Vizioz
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Deep UV Lithography for 0.35μm Design Rules Application to CMOS Technology with Three Metallization Levels
1994
Ndt & E International
F. Vinet
Nicolas Buffet
M. Heitzmann
M. Laurens
Ch. Le Cornec
M. Lerme
P. Molle
Y. Morand
Tobias Mourier
H. Ullmann
C. Vizioz
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Deep-UV positive resist image by dry etching (DUV PRIME): a robust process for 0.3-μm contact holes
1994
Didier Louis
Philippe Laporte
Pascale Molle
H. Ullmann
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Spin on glass (SOG) etch-back planarization process: an industrial solution for 0.5-um CMOS TLM technology
1993
Pascale Molle
H. Ullmann
B. Gros
P. Fugier
O. Demolliens
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