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Robert W. Wu

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Pilot studies of the manufacturing worthiness of mixed chemistry processings in a MERIE plasma tool

2000 ASMC | Advanced Semiconductor Manufacturing Conference
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Procede d'attaque au plasma pour attaque selective d'un oxyde au moyen de fluoropropane ou de fluoropropylene

1998
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MxP+: A new dielectric etcher with enabling technology, high productivity, and low cost‐of‐consumables

1996 Journal of Vacuum Science & Technology B
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Citations (9)