author-photo

Chih-Chiang Fu

I-Shou University

4

Papers

2

Citations

Citation Trend

Filter By

Papers (3) Sort By

Journal Conference Others

An investigation on dicing 28-nm node Cu/low-k wafer with a Picosecond Pulse Laser

2014
Show All
- Source
- Cite
- Save
Citations (0)
An experimental study on dicing 28 nm low-k water using laser grooving technique

2014 IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Show All
- Source
- Cite
- Save
Citations (1)
Cutting PCB with a 532nm DPSS green laser

2014 IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Show All
- Source
- Cite
- Save
Citations (1)