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An investigation on dicing 28-nm node Cu/low-k wafer with a Picosecond Pulse Laser
An investigation on dicing 28-nm node Cu/low-k wafer with a Picosecond Pulse Laser
2014
Hsiang-Chen Hsu
Li-Ming Chu
Baojun Liu
Chih-Chiang Fu
Keywords:
Wafer dicing
Electronic engineering
Wafer
Pulsed laser deposition
Picosecond
Materials science
picosecond pulse
Laser
Nanotechnology
Optoelectronics
Correction
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