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R. Fransiscus

GlobalFoundries

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Failure Analysis Techniques and Studies on Vertical Short Issue for Production Wafers

2021 IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
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Back End of Line (BEOL) Pulse Nanoprobing Fault Isolation Technique on RF Device with Soft Failure Issue

2020
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Failure Analysis on Inter Polysilicon Oxide Reliability Issues of 40nm Automotive NVM Device

2019
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