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M. Lux

Katholieke Universiteit Leuven

12

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122

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BEOL compatible WS2 transistors fully fabricated in a 300 mm pilot line

2017 SNW | IEEE Silicon Nanoelectronics Workshop
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WS 2 transistors on 300 mm wafers with BEOL compatibility

2017 ESSDERC | European Solid-State Device Research Conference
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An environment friendly wet strip process for 193nm lithography patterning in BEOL applications

2013 Microelectronic Engineering
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Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: Application to accelerometers

2011 MEMS | International Conference on Micro Electro Mechanical Systems
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Removal of post-etch 193nm photoresist in porous low-k dielectric patterning using UV irradiation and ozonated water

2010 Microelectronic Engineering
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Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects

2009 IITC | International Interconnect Technology Conference
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Selection of ESH solvents for the wet removal of post-etch photoresists in low-k dielectrics integration

2009 Microelectronic Engineering
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Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces

2009 Microelectronic Engineering
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Roadblocks and Critical Aspects of Cleaning for Sub-65nm Technologies

2006 VLSI-TSA | International Symposium on VLSI Technology, Systems, and Applications
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Roadblocks andCritical Aspects ofCleaning forSub-65nm Technologies

2006
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