Old Web
English
Sign In
Acemap
>
authorDetail
>
Rikiya Kamimura
Rikiya Kamimura
Inverter
Packaging engineering
Electronic engineering
Composite material
Materials science
2
Papers
9
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application
2017
ECTC | Electronic Components and Technology Conference
Kohei Tatsumi
Masakazu Inagaki
Kazuhito Kamei
Tomonori Iizuka
Hiroaki Narimatsu
Nobuaki Sato
Koji Shimizu
Kazutoshi Ueda
Akihiro Imakire
Masayuki Hikita
Rikiya Kamimura
Kazuhiko Sugiura
Kazuhiro Tsuruta
Keiji Toda
Show All
Source
Cite
Save
Citations (9)
回路基板、回路基板の製造方法、及び電子回路装置
2005
Masayuki Aoyama
Rikiya Kamimura
Toshihiro Sakakima
rikiya kamimura
tosihiro sakaki kan
masayuki aoyama
Show All
Source
Cite
Save
Citations (0)
1