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Hiroaki Narimatsu

3

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Thermal Characteristic Evaluation and Transient Thermal Analysis of Next-generation SiC Power Module at 250 °C

2018
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Thermal characteristic evaluation and transient thermal analysis of next-generation sic power module at 250 °C

2018
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Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application

2017 ECTC | Electronic Components and Technology Conference
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