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Yun Liu
Yun Liu
STMicroelectronics
Electronic engineering
Wafer-level packaging
Ball grid array
Embedded Wafer Level Ball Grid Array
Engineering
3
Papers
2
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(Invited) Development of Advanced Fan-Out Wafer Level Package
2013
Yonggang Jin
Jerome Teysseyre
Anandan Ramasamy
Yun Liu
Bing Hong Huang
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Embedded wafer level BGA (eWLB) - Multi-die
2010
EPTC | Electronics Packaging Technology Conference
Ramasamy Anandan
Yonggang Jin
Yaohuang Huang
Kah Wee Gan
Puay Gek Chua
Yun Liu
Christian Geissler
Goh Hin Hwa
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