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Goh Hin Hwa
Goh Hin Hwa
Wafer-level packaging
Embedded Wafer Level Ball Grid Array
Electronic engineering
Electronic packaging
Wafer testing
3
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6
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Embedded wafer level BGA (eWLB) - Multi-die
2010
EPTC | Electronics Packaging Technology Conference
Ramasamy Anandan
Yonggang Jin
Yaohuang Huang
Kah Wee Gan
Puay Gek Chua
Yun Liu
Christian Geissler
Goh Hin Hwa
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A low cost wafer level packaging process
2000
IEMT | International Electronics Manufacturing Technology Symposium
Rahul Kapoor
Swee Yong Khim
Goh Hin Hwa
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