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Yaohuang Huang
Yaohuang Huang
STMicroelectronics
Wafer-level packaging
Electronic engineering
Ball grid array
Embedded Wafer Level Ball Grid Array
Engineering
3
Papers
17
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Embedded wafer level BGA (eWLB) - Multi-die
2010
EPTC | Electronics Packaging Technology Conference
Ramasamy Anandan
Yonggang Jin
Yaohuang Huang
Kah Wee Gan
Puay Gek Chua
Yun Liu
Christian Geissler
Goh Hin Hwa
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Citations (2)
Challenges for extra large embedded wafer level ball grid array development
2009
EPTC | Electronics Packaging Technology Conference
Jing-en Luan
Yonggang Jin
Kim-yong Goh
Yiyi Ma
Guojun Hu
Yaohuang Huang
Xavier Baraton
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Citations (15)
1