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Charlie Reynolds
Charlie Reynolds
IBM
Electronic engineering
Ball grid array
Soldering
Composite material
Thermal grease
2
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1
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Reliability Demonstration of an Ultra-Thin Core (UTC) Large Die, Large Laminate Package
2016
ECTC | Electronic Components and Technology Conference
Tomoyuki Yamada
Michio Ohori
Fumio Kumokawa
Hiroyuki Fukushima
Sushumna Iruvanti
Shidong Li
Tuhin Sinha
Jeff Coffin
Hai P. Longworth
Charlie Reynolds
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Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale Package
2014
Tomoyuki Yamada
Masahiro Fukui
Kenji Terada
Masaaki Harazono
Teruya Fujisaki
Sushumna Iruvanti
Charles Carey
Yi Pan
Charlie Reynolds
Kamal K. Sikka
Brian R. Sundlof
Hilton T. Toy
Rebecca N. Wagner
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