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Teruya Fujisaki
Teruya Fujisaki
Chip-scale package
Chip
Electronic engineering
Process capability
Soldering
2
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2
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0
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2024
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Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale Package
2014
Tomoyuki Yamada
Masahiro Fukui
Kenji Terada
Masaaki Harazono
Teruya Fujisaki
Sushumna Iruvanti
Charles Carey
Yi Pan
Charlie Reynolds
Kamal K. Sikka
Brian R. Sundlof
Hilton T. Toy
Rebecca N. Wagner
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Organic Chip Scale Package (CSP) Development for Flip Chip Applications
2013
Tomoyuki Yamada
Masahiro Fukui
Kenji Terada
Masaaki Harazono
Teruya Fujisaki
Charles L. Reynolds
Jean Audet
Yi Pan
Scott Preston Moore
Sushumna Iruvanti
Hsichang Liu
Hongqing Zhang
Brian R. Sundlof
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