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Kimin Hong
Kimin Hong
Semiconductor device fabrication
Electroplating
Microstructure
Electromigration
Metallurgy
2
Papers
5
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0
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Engineering gap fill, microstructure and film composition of electroplated copper for on-chip metallization
2001
IITC | International Interconnect Technology Conference
Valery M. Dubin
Christopher D. Thomas
N. Baxter
Carolyn Block
Vinay B. Chikarmane
P. McGregor
David Jentz
Kimin Hong
S. Hearne
C. Zhi
D. Zierath
B. Miner
Markus Kuhn
A Budrevich
Harsono S. Simka
Sadasivan Shankar
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Composition de bain de depot electrolytique et son procede d'utilisation
2001
Kimin Hong
Nathan E Baxter
Valery M. Dubin
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