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Kundan Nepal

University of St. Thomas (Minnesota)
Bucknell University
Brown University

56

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431

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Low Power Shift and Capture through ATPG-Configured Embedded Enable Capture Bits.

2021 ITC | International Test Conference
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3D Ring Oscillator based Test Structures to Detect a Trojan Die in a 3D Die Stack in the Presence of Process Variations

2020 IEEE Transactions on Emerging Topics in Computing
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Cost-Effective, Re-Configurable Cluster Approach for Resource Constricted FPGA Based Machine Learning and AI Applications

2020
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Low-cost instrumentation of high-tunnels for a small co-op farm

2019 GHTC | Global Humanitarian Technology Conference
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Dilated Temporal Convolutional Neural Network Architecture with Independent Component Layer for Human Activity Recognition

2019 ICECS | International Conference on Electronics, Circuits, and Systems
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Repurposing FPGAs for Tester Design to Enhance Field-Testing in a 3D Stack

2019 Journal of Electronic Testing
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Test Architecture for Fine Grained Capture Power Reduction

2019 ICECS | International Conference on Electronics, Circuits, and Systems
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True Three-Valued Ternary Content Addressable Memory Cell Based On Ambipolar Carbon Nanotube Transistors

2018 Journal of Circuits, Systems, and Computers
- Daniel Hellkamp
- Kundan Nepal
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Detecting a trojan die in 3D stacked integrated circuits

2017 NATW | North Atlantic Test Workshop
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Stimulating curiosity and the ability to formulate technical questions in an electric circuits course using the question formulation technique (QFT)

2017 FIE | Frontiers in Education Conference
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