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Yu-Jiau Hwang

4

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A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication

2007 IEEE Transactions on Advanced Packaging
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A novel WLCSP technology with high reliability, low cost and ease of fabrication

2004 EPTC | Electronics Packaging Technology Conference
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The evaluation of flip chip bumping on Cu/low-/spl kappa/ wafer

2002 EPTC | Electronics Packaging Technology Conference
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The development of enhanced wafer level packaging

2002 EPTC | Electronics Packaging Technology Conference
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