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Bruno Delahaye
Bruno Delahaye
Altis Semiconductor
Engineering
Electronic engineering
Chemical-mechanical planarization
Root cause
Shallow trench isolation
7
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7
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Highly Resistive AlN Formation in TiN / AlCu / TiN Stack Evidenced by EELS TEM and XPS
2010
Bruno Delahaye
H. Fray
J.P. Brun
N. Guilbaud
P. Tabary
S. Lariviere
D. Basso
M Modi
M. Idir
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Minimum power fail in high density structure improved by Chemical and Mechanical Polishing optimization
2009
ASMC | Advanced Semiconductor Manufacturing Conference
L. Denis
V. Dureuil
C. Fournier
Gaelle Richou
F. Nogueira
D. Petit
M. Bostelmann
M. Comas
D. Dorval
P. Deconinck
Bruno Delahaye
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Dual Gate oxide reliability improved by Spacer and Salicide process optimisation
2008
ASMC | Advanced Semiconductor Manufacturing Conference
Gaelle Richou
D. Ottenwaelder
Jean-Luc Baltzinger
Bruno Delahaye
F. Domart
A. Soudry
A. Coudray
J.F. Langlois
J. Liebault
D. Donnard
D. Garroux
P. Fraquet
F. Nogueira
N. Laporte
H. Lefevre
J.P. Brun
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