Old Web
English
Sign In
Acemap
>
authorDetail
>
Masaki Nakanishi
Masaki Nakanishi
Renesas Electronics
Electronic engineering
Interposer
Chip
Interconnection
Materials science
4
Papers
35
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (4)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Puce de semi-conducteur, substrat intermédiaire et dispositif à semi-conducteur
2009
Hanae Hata
sin hanae
Masato Nakamura
nakamura masato
Masaki Nakanishi
masaki nakanisi
Nobuhiro Kinoshita
kinosita nobuhiro
Yoshihide Yamaguchi
yamaguti kin syuu
Jumpei Konno
junpei konno
Show All
Source
Cite
Save
Citations (0)
Through-Silicon via Interconnection for 3D Integration Using Room-Temperature Bonding
2009
IEEE Transactions on Advanced Packaging
Naotaka Tanaka
Yasuhiro Yoshimura
Michihiro Kawashita
Toshihide Uematsu
Chuichi Miyazaki
Norihisa Toma
Kenji Hanada
Masaki Nakanishi
Takahiro Naito
Takafumi Kikuchi
Takashi Akazawa
Show All
Source
Cite
Save
Citations (14)
Substrat intermédiaire, puce lsi et dispositif de terminal d'informations utilisant le substrat intermédiaire, procédé de fabrication du substrat intermédiaire, et procédé de fabrication de la puce lsi
2008
Hanae Hata
Masato Nakamura
Masaki Nakanishi
Nobuhiro Kinoshita
Show All
Source
Cite
Save
Citations (0)
Ultra-Thin 3D-Stacked SIP Formed using Room-Temperature Bonding between Stacked Chips
2005
ECTC | Electronic Components and Technology Conference
Naotaka Tanaka
Yoshihiro Yoshimira
Takahiro Naito
Chuichi Miyazaki
Yoshihiko Nemoto
Masaki Nakanishi
Takashi Akazawa
Show All
Source
Cite
Save
Citations (21)
1