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M. Degawa

Hitachi

4

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Out-of-plane axis SOI MEMS gyroscope with initially displaced vertical sensing comb

2011 TRANSDUCERS | International Conference on Solid-State Sensors, Actuators and Microsystems
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Wafer-level two-step bonding process for combined sensor with two different pressure chambers

2011 TRANSDUCERS | International Conference on Solid-State Sensors, Actuators and Microsystems
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Capacitive micromachined ultrasonic transducer with driving voltage over 100 V and vibration durability over 10 11 cycles

2009 International Conference on Solid-State Sensors, Actuators and Microsystems
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Laterally-driven deformation-robust MEMS gyroscopes with three sets of symmetrically arranged folded-beam suspensions

2009 International Conference on Solid-State Sensors, Actuators and Microsystems
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