Wafer-level two-step bonding process for combined sensor with two different pressure chambers
2011
We developed a wafer-level two-step anodic bonding process for a combined sensor with two different pressure chambers: ambient and low vacuum pressure. This two-step bonding process features: a bonding and non-bonding area controlled with a glass bump array, an anodic bonding process with plastic deformation of the glass bumps at high temperature and high loading, and two different pressure chambers formed with a sequence of bonding processes.
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