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Lingyun Wei
Lingyun Wei
Dow Chemical Company
Metallurgy
Ductility
Copper plating
Calculus
Engineering
4
Papers
4
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Invited) Copper Plating and Its Application in Advanced Packaging
2016
Lingyun Wei
Matthew Thorseth
Mark Scalisi
Jonathan Prange
Inho Lee
Yil-Hak Lee
yoon Joo Kim
Mark Lefebvre
Jeffrey M. Calvert
Wataru Tachikawa
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Bain d'électrodéposition de cuivre acide et procédé de galvanisation à faible contrainte interne et une bonne ductilité des dépôts de cuivre
2016
Lingyun Wei
Rebecca Hazebrouck
Bryan Lieb
Yu-Hua Kao
Mark Lefebvre
Robert Corona
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