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Jeffrey M. Calvert

Dow Chemical Company

7

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Invited) Copper Plating and Its Application in Advanced Packaging

2016
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Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications

2015
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From C4 to micro-bump: Adapting lead free solder electroplating processes to next-gen advanced packaging applications

2014 ECTC | Electronic Components and Technology Conference
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Seed layer repair and electroplating

2001
- Robert D. Mikkola
- Jeffrey M. Calvert
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