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Mark Scalisi
Mark Scalisi
Dow Chemical Company
Materials science
Nanotechnology
Copper plating
Electroplating
Electronic engineering
4
Papers
1
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0
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Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications
2017
Rosemary Bell
Joseph Lachowski
Mitsuru Haga
Inho Lee
Regina Cho
Matthew Thorseth
Jonathan Prange
Mark Scalisi
Yi Qin
Yun Hyeon Kim
Wataru Tachikawa
yoon Joo Kim
Mark Lefebvre
Jeff Calvert
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Invited) Copper Plating and Its Application in Advanced Packaging
2016
Lingyun Wei
Matthew Thorseth
Mark Scalisi
Jonathan Prange
Inho Lee
Yil-Hak Lee
yoon Joo Kim
Mark Lefebvre
Jeffrey M. Calvert
Wataru Tachikawa
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Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications
2016
Matthew Thorseth
Mark Scalisi
Inho Lee
Sang-Min Park
Yil-Hak Lee
Jonathan Prange
Masaaki Imanari
Mark Lefebvre
Jeff Calvert
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