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Nicholas Liao
Nicholas Liao
Materials science
Composite material
Scanning electron microscope
Molding (process)
Material properties
5
Papers
82
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Creative Invention Benchmark
2018
arXiv: Artificial Intelligence
Matthew Guzdial
Nicholas Liao
Vishwa Shah
Mark O. Riedl
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Citations (1)
Effects of reliability testing methods on microstructure and strength at the Cu wire-Al pad interface
2013
ECTC | Electronic Components and Technology Conference
Peng Su
Hidetoshi Seki
Chen Ping
Shingo Itoh
Louie Huang
Nicholas Liao
Bill Liu
Curtis Chen
Winnie Tai
Andy Tseng
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Citations (6)
An evaluation of effects of molding compound and substrate material properties on reliability of Cu wire BGA components
2012
ECTC | Electronic Components and Technology Conference
Peng Su
Hidetoshi Seki
Yoshinori Nishitani
Chen Ping
Shin-ichi Zenbutsu
Shingo Itoh
Louie Huang
Nicholas Liao
Bill Liu
Curtis Chen
Winnie Tai
Andy Tseng
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Citations (6)
An evaluation of effects of molding compound properties on reliability of Cu wire components
2011
ECTC | Electronic Components and Technology Conference
Peng Su
Hidetoshi Seki
Chen Ping
Shin-ichi Zenbutsu
Shingo Itoh
Louie Huang
Nicholas Liao
Bill Liu
Curtis Chen
Winnie Tai
Andy Tseng
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Citations (49)
An evaluation of effects of molding compound properties on reliability of Cu wire components
2011
Electronic Components and Technology Conference
Peng Su
Hidetoshi Seki
Ping Chen
Shin-ichi Zenbutsu
Shingo Itoh
Louie Huang
Nicholas Liao
William Ming Liu
Curtis Chen
Winnie Tai
Andy Tseng
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Citations (20)
1