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An evaluation of effects of molding compound properties on reliability of Cu wire components
An evaluation of effects of molding compound properties on reliability of Cu wire components
2011
Peng Su
Hidetoshi Seki
Ping Chen
Shin-ichi Zenbutsu
Shingo Itoh
Louie Huang
Nicholas Liao
William Ming Liu
Curtis Chen
Winnie Tai
Andy Tseng
Keywords:
Scanning electron microscope
Copper
Molding (process)
Material properties
Materials science
Analytical chemistry
Composite material
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