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Shin-ichi Zenbutsu
Shin-ichi Zenbutsu
Molding (process)
Materials science
Composite material
Wire bonding
Scanning electron microscope
5
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107
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An evaluation of effects of molding compound and substrate material properties on reliability of Cu wire BGA components
2012
ECTC | Electronic Components and Technology Conference
Peng Su
Hidetoshi Seki
Yoshinori Nishitani
Chen Ping
Shin-ichi Zenbutsu
Shingo Itoh
Louie Huang
Nicholas Liao
Bill Liu
Curtis Chen
Winnie Tai
Andy Tseng
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Citations (6)
An evaluation of effects of molding compound properties on reliability of Cu wire components
2011
ECTC | Electronic Components and Technology Conference
Peng Su
Hidetoshi Seki
Chen Ping
Shin-ichi Zenbutsu
Shingo Itoh
Louie Huang
Nicholas Liao
Bill Liu
Curtis Chen
Winnie Tai
Andy Tseng
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Citations (49)
An evaluation of effects of molding compound properties on reliability of Cu wire components
2011
Electronic Components and Technology Conference
Peng Su
Hidetoshi Seki
Ping Chen
Shin-ichi Zenbutsu
Shingo Itoh
Louie Huang
Nicholas Liao
William Ming Liu
Curtis Chen
Winnie Tai
Andy Tseng
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Citations (20)
Study of EMC for Cu Bonding Wire Application
2011
CSTIC | China Semiconductor Technology International Conference
Toshiro Takeda
Hidetoshi Seki
Shingo Itoh
Shin-ichi Zenbutsu
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Citations (1)
Study of EMC for Cu bonding wire application
2010
ICSJ | CPMT Symposium Japan
Hidetoshi Seki
Chen Ping
Hiroshi Nakatake
Shin-ichi Zenbutsu
Shingo Itoh
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Citations (31)
1