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Olivier Dubreuil
Olivier Dubreuil
STMicroelectronics
Grain growth
Materials science
Copper interconnect
Metallurgy
Copper
4
Papers
17
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Characterization and impact of reduced copper plating overburden on 45nm interconnect performances
2010
Microelectronic Engineering
Olivier Dubreuil
Véronique Caubet-Hilloutou
J. Guillan
K. Haxaire
M. Mellier
Pierre Caubet
P. Vannier
E. Petitprez
Daniel Bellet
P. Normandon
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Citations (3)
Cu Grain Growth in Damascene Narrow Trenches
2009
Sylvain Maitrejean
V. Carreau
O. Thomas
S. Labat
Belkhiri Kaouache
M. Verdier
Joel Lepinoux
Yves Bréchet
Marc Legros
Joël Douin
Stefan Brandstetter
Cyril Cayron
Olivier Sicardy
D. Weygand
Olivier Dubreuil
P. Normandon
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Citations (8)
Characterization of copper grain growth limitations inside narrow wires depending of overburden thickness
2008
Microelectronic Engineering
Olivier Dubreuil
M. Cordeau
T. Mourier
Pascale Chausse
M. Mellier
Daniel Bellet
Joacquin Torres
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Citations (6)
Cu grain growth in damascene narrow trenches
2008
Sylvain Maitrejean
V. Carreau
Olivier Thomas
S. Labat
Belkhiri Kaouache
M. Verdier
Joel Lepinoux
Yves Bréchet
Marc Legros
Joël Douin
Cyril Cayron
Olivier Sicardy
D. Weygand
Olivier Dubreuil
P. Normandon
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