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Véronique Caubet-Hilloutou
Véronique Caubet-Hilloutou
STMicroelectronics
Materials science
Grain growth
Copper
Overburden
Annealing (metallurgy)
2
Papers
6
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0
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2024
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Dielectrics stability for intermediate BEOL in 3D sequential integration
2017
Microelectronic Engineering
F. Deprat
C. Fenouillet-Beranger
V. Jousseaume
Chloé Guerin
Virginie Beugin
N. Rochat
C. Licitra
Véronique Caubet-Hilloutou
D. Benoit
Gregory Imbert
N. Rambal
Perrine Batude
Maud Vinet
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Citations (3)
Characterization and impact of reduced copper plating overburden on 45nm interconnect performances
2010
Microelectronic Engineering
Olivier Dubreuil
Véronique Caubet-Hilloutou
J. Guillan
K. Haxaire
M. Mellier
Pierre Caubet
P. Vannier
E. Petitprez
Daniel Bellet
P. Normandon
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Citations (3)
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