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Garlen C. Leung
Garlen C. Leung
Applied Materials
Engineering
Manufacturing engineering
Abrasive
Electronic engineering
Planarity testing
5
Papers
11
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Direct Polish STI HSS CMP with Improved Planarity and Defect Performance
2012
A Iyer
T. Yang
T. Li
Jie Diao
Christopher Heung-Gyun Lee
Garlen C. Leung
T. Osterheld
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New Polish Chemistry and Process for Improved Fixed Abrasive CMP Performance
2011
Gregory E. Menk
R. Marks
Garlen C. Leung
A. Iyer
Jie Diao
Y. Zhou
Christopher Heung-Gyun Lee
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ILD0 CMP: Technology enabler for high K metal gate in high performance logic devices
2010
ASMC | Advanced Semiconductor Manufacturing Conference
Jie Diao
Garlen C. Leung
Jun Qian
Sean Cui
Anand N. Iyer
Christopher Heung-Gyun Lee
Balaji Chandrasekaran
Thomas H. Osterheld
Lakshmanan Karuppiah
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Citations (4)
Scalability enhancement of FG NAND by FG shape modification
2010
IMW | International Memory Workshop
Udayan Ganguly
Yoshitaka Yokota
Jing Tang
Shiyu Sun
Matthew Scott Rogers
Miao Jin
Kiran V. Thadani
Hiroshi Hamana
Garlen C. Leung
Balaji Chandrasekaran
Sunderraj Thirupapuliyur
C. Olsen
Vicky Nguyen
Swami Srinivasan
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Citations (5)
Feuille à polir linéaire d'une seule pièce
2009
Benjamin A. Bonner
Gopalakrishna B. Prabhu
Erik S. Rondum
Gregory E. Menk
Anand N. Iyer
Peter McReynolds
Garlen C. Leung
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