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Dirk J. Bartelink

Hewlett-Packard

5

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109

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A proposed holistic approach to on-chip, off-chip, test, and package interconnections

1998 Characterization and Metrology for ULSI Technology
- Dirk J. Bartelink
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A unified approach to chip, test, and assembly technologies for MCMs

1995 MCMC | IEEE Multi-Chip Module Conference
- Dirk J. Bartelink
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Use of short-loop electrical measurements for yield improvement

1995 IEEE Transactions on Semiconductor Manufacturing
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Statistical metrology for interlevel dielectric thickness variation

1994
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