Old Web
English
Sign In
Acemap
>
authorDetail
>
Timo Tick
Timo Tick
IBM
Materials science
Electronic engineering
Chip
Composite material
Thermal power station
5
Papers
24
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (5)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Embedded power insert enabling dual-side cooling of microprocessors
2015
ECTC | Electronic Components and Technology Conference
Thomas Brunschwiler
Dominic Gschwend
Stephan Paredes
Timo Tick
Keiji Matsumoto
Christoph Lehnberger
Jens Pohl
Uwe Zschenderlein
Stefano Oggioni
Show All
Source
Cite
Save
Citations (2)
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
2014
ESTC | Electronics System-integration Technology Conference
Thomas Brunschwiler
Timo Tick
Michele Castriotta
Gerd Schlottig
Dominic Gschwend
Ken Sato
Takashi Nakajima
Shidong Li
Stefano Oggioni
Show All
Source
Cite
Save
Citations (4)
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
2014
ESTC | Electronics System-integration Technology Conference
Thomas Brunschwiler
Ralph Heller
Gerd Schlottig
Timo Tick
Hubert Harrer
Harry Barowski
Tim Niggemeier
Jochen Supper
Stefano Oggioni
Show All
Source
Cite
Save
Citations (6)
Laminate with Thermal - Power Insert for Efficient Front-Side Heat Removal and Power Delivery
2014
Dominic Gschwend
Timo Tick
Stefano Oggioni
Stephan Paredes
Keiji Matsumoto
Manish Kumar Tiwari
Dimos Poulikakos
Thomas Brunschwiler
Show All
Source
Cite
Save
Citations (5)
Investigation of novel solder patterns for power delivery and heat removal support
2013
ECTC | Electronic Components and Technology Conference
Thomas Brunschwiler
Yassir Madhour
Timo Tick
Gerd Schlottig
Stefano Oggioni
Show All
Source
Cite
Save
Citations (7)
1