Embedded power insert enabling dual-side cooling of microprocessors
2015
A dual-side cooling topology is proposed that is achieved by embedding a power insert into the organic substrate of a chip or chip stack. The power insert consists of vertical copper lamellas supporting lateral current feed in addition to vertical heat dissipation at minimal electrical and thermal gradients. The lateral current feed capability is key to enable the introduction of the cold plate on the bottom side of the substrate.
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