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Dominic Gschwend

IBM

4

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23

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Embedded power insert enabling dual-side cooling of microprocessors

2015 ECTC | Electronic Components and Technology Conference
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Steady-state low thermal resistance characterization apparatus: The bulk thermal tester

2015 Review of Scientific Instruments
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Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation

2014 ESTC | Electronics System-integration Technology Conference
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