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Steve Lin
Steve Lin
KLA-Tencor
Wafer
Copper interconnect
Chemical-mechanical planarization
Engineering
Electronic engineering
3
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2
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Detecting buried voids in copper interconnect
2013
Hsiang-Chou Liao
Tuung Luoh
Ling-Wu Yang
Tahone Yang
Kuang-Chao Chen
Chih-Yuan Lu
Steve Lin
Alex Cheng
Ivan Yao
SiYeul Yoon
Olivier Moreau
Hong Xiao
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Development of CMP pad using an unpatterned surface inspection system
2012
ASMC | Advanced Semiconductor Manufacturing Conference
C. Y. Cheng
S. N. Peng
S. C. Chen
Larry Yang
Debbie Hu
Steve Lin
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Immersion lithography process improvements by wafer edge inspection at 300mm DRAM manufacturing fab
2010
ISSM | International Symposium on Semiconductor Manufacturing
Marlene Strobl
Calvin Hsu
Yu Chen Lin
Howard Chen
Damian Chen
Alex Cheng
WonGun Lee
Steve Lin
Oreste Donzella
Ribi Leung
Jennifer Kopp
Becky Pinto
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