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Friedrich-Leonhard Schein

Technical University of Berlin

5

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5

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Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates

2021 ECTC | Electronic Components and Technology Conference
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High Density RDL Technologies for Panel Level Packaging of Embedded Dies

2021
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High Density Fan-Out Panel Level Packaging of Multiple Dies Embedded in IC Substrates

2019 EMPC | European Microelectronics and Packaging Conference
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Evaluation of adaptive processes for the embedding of bare dies in IC substrates

2019 EMPC | European Microelectronics and Packaging Conference
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High Density Interconnect Processes for Panel Level Packaging

2018 Electronics System-integration Technology Conference
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