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Marc Kunz
Marc Kunz
Plasma etching
Optoelectronics
Microvia
Photoresist
Lamination
5
Papers
22
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High Density Fan-Out Panel Level Packaging of Multiple Dies Embedded in IC Substrates
2019
EMPC | European Microelectronics and Packaging Conference
Friedrich-Leonhard Schein
R. Kahle
Marc Kunz
Andreas Ostmann
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Process Modules for High Density Interconnects in Panel Level Packaging
2019
IEEE Transactions on Components, Packaging and Manufacturing Technology
Friedrich-Leonhard Schein
R. Kahle
Marc Kunz
Tim Kunz
Jordan Kossev
Tobias Müller
Mathias Pentz
Michael Dietterle
Andreas Ostmann
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Boîtier en plastique multi-composants
2016
Marc Kunz
Werner Huebscher
Kris Lueckel
Sven Schaefer
Stefan Gehard Triebig
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