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Ewald Strolz
Ewald Strolz
Materials science
Electronic engineering
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4
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7
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Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates
2021
ECTC | Electronic Components and Technology Conference
Friedrich-Leonhard Schein
Mohammed Elghazzali
Christian Voigt
Ioannis Tsigaras
Hirofumi Sawamoto
Ewald Strolz
Roland Rettenmeier
Lars Böttcher
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Impact of Process Control on UBM/RDL Contact Resistance for Next-Generation Fan-Out Devices
2017
ECTC | Electronic Components and Technology Conference
Patrik Carazzetti
Frantisek Balon
Mike Hoffmann
Juergen Weichart
Andreas Erhart
Ewald Strolz
Kay Viehweger
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Indexer PVD platform — The key enabler for high productivity and low contact resistance for next-generation WLP applications
2017
EPTC | Electronics Packaging Technology Conference
Patrik Carazzetti
Frantisek Balon
Mike Hoffmann
Juergen Weichart
Andreas Erhart
Ewald Strolz
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