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Akamatsu Kensuke
Akamatsu Kensuke
Reducing agent
Metallurgy
Materials science
Copper plating
Microcontact printing
2
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Formation of ULSI Cu Minute Wiring Through Microcontact Printing Using Silicone
2009
ICEP | International Conference on Electronics Packaging
Nakajima Katsuyuki
Akamatsu Kensuke
Nawafune Hidemi
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Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization
2004
Hidemi Nawafune
Yuichiro Kobata
Yuji Morikawa
Nawafune Hidemi
Kobata Yuichiyo
Morikawa Yuji
Akamatsu Kensuke
Murakami Yoshiki
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