Old Web
English
Sign In
Acemap
>
Paper
>
Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization
Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization
2004
Hidemi Nawafune
Yuichiro Kobata
Yuji Morikawa
Nawafune Hidemi
Kobata Yuichiyo
Morikawa Yuji
Akamatsu Kensuke
Murakami Yoshiki
Keywords:
Reducing agent
Metallurgy
Materials science
Copper plating
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]