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Kazuhisa Kudo

4

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Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer

2002 IEICE Transactions on Electronics
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A thick-Cu process for add-on interconnections using photosensitive varnish for thick interlayer dielectric

2000 IITC | International Interconnect Technology Conference
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A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon

2000 Japanese Journal of Applied Physics
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A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon

1999 The Japan Society of Applied Physics
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