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Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
2002
Kunio Saito
Toshihiko Kosugi
Chikara Yamaguchi
Kazuhisa Kudo
Masaki Yano
Shoji Yagi
Hiromu Ishii
Katsuyuki Machida
Hakaru Kyuragi
Keywords:
Electronic engineering
Polymer
Chip
Copper interconnect
Engineering
photosensitive polymer
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